The processor temperature depends in particular on the component power dissipation, the processor package thermal characteristics, and the processor thermal solution.Īll of these parameters are affected by the continued push of technology to increase processor performance levels and packaging density (more transistors). The system level thermal constraints consist of the local ambient air temperature and airflow over the processor as well as the physical constraints at and above the processor. In a system environment, the processor temperature is a function of both system and component thermal characteristics. Temperatures exceeding the maximum operating limit of a component may result in irreversible changes in the operating characteristics of this component. Operation outside the functional temperature range can degrade system performance, cause logic errors, or cause component and/or system damage. Within this temperature range, a component is expected to meet its specified performance. The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within their functional temperature range. Supporting the Intel® Core™ 2 Duo desktop processor E6000 and E4000 sequences, Intel® Pentium® Dual Core Processor E2000 sequence, and Intel® Pentium® 4 processor Intel® Core™ 2 Duo Desktop Processor, Intel® Pentium® Dual Core Processor, and Intel® Pentium® 4 Processor 6x1 Sequence Thermal and Mechanical Design Guidelines This story originally appeared on Ars Technica.Intel® Core™ 2 Duo, Intel® Pentium® Dual-Core, Thermal Design Whether that tradeoff is worth it (and we'll be checking this as we review the new models) is up to users to decide. Apple decided to trade maximum performance for increased battery life and portability and still offer a lower price than the previous generation. While some comparable ultraportables use newer Arrandale chips in them, most also cost significantly more than the revised MacBook Air models. The combination of Core 2 Duo processor and NVIDIA 320M graphics is more powerful than the Atom and Intel IGP combo used in notebooks of similar size. The slower processors clock in at just 10W TDP (7W less than those used in the 13-inch models) making it much easier to cool the inside of the tiny 11.6-inch casing. The reason for the difference here is simple: thermal design. While its bigger brother offers a 1.86-GHz or 2.13-GHz CPU, the smaller sibling is left with just 1.4-GHz or 1.6-GHz options. With seven hours of promised life without any need for an external battery, it can be argued that this is a useful trade-off.įinally, we have to consider the 11-inch MacBook Air. Instead of giving up room to shoehorn in updated processors, Apple instead chose to improve the MacBook Air's battery capacity. The combination simply couldn't fit on the MacBook Air's minuscule logic board. Even with the integrated northbridge and GPU, Arrandale processors still require a separate controller. The dual-chip packages are considerably larger than the small-outline packages for the low-voltage Core 2 Duos originally introduced on the first MacBook Air.
INTEL POWER GADGET CORE 2 DUO UPDATE
Apple argued that the improved graphics power of the 320M was more important than improved CPU processing power when designing the recent 13-inch MacBook Pro update - that same logic (though you may disagree with the decision) still applies here. And it's also compatible with OpenCL, something Intel has yet to support in its IGPs. The multicore GPU integrated into the NVIDIA 320M handily spanks the (admittedly improved) Intel integrated graphics glued onto the Core i-series processors.
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